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Photovoltaic materials are also called solar cell materials. Only semiconductor materials have this function. Solar photovoltaic power generation industry chain is divided into five links, that is, from silicon materials to silicon wafers, solar cells, solar cell modules, and finally to photovoltaic power generation system applications. The silicon wafer multi-wire cutting technology in the upper reaches of the photovoltaic industry mainly adopts silicon carbide powder as the cutting edge material and is supplemented with other reagents for cutting. In this technology, the quality of the green silicon carbide powder directly determines the efficiency of the slice. Therefore, silicon carbide fine powder is an indispensable and consumable material in the cutting process, and is also called a “cutter†in the hands of photovoltaic companies. Who owns the best tool will take the lead in cutting. Therefore, silicon carbide powder plays an important role in the slicing industry.
With the rapid development of the photovoltaic industry, the demand for silicon carbide for silicon wafer wire cutting is increasing. The silicon carbide powder for silicon wafer wire cutting is an indispensable material for the production of silicon wafers for solar cells, and has a huge domestic and foreign market. The economic benefits are good. At present, mainly in the domestic green silicon carbide powder, because of its own characteristics determine its more suitable for photovoltaic, semiconductor wafer cutting edge materials.
Effect of Particle Size on Silicon Carbide
Silicon carbide powder is one of the most important abrasives used in multi-wire cutting machines. The particle size and particle size of the fine powder are the key to the smoothness and cutting ability of the silicon wafer. The particle size and particle size of the silicon carbide powder, the viscosity of the mortar, the flow of the mortar, the speed of the steel wire, the tension of the steel wire, and the feed rate of the workpiece. The cutting of silicon wafers is essentially the cutting of silicon carbide powder particles. The regular shape of the particles is very good. The surface roughness of cut wafers will be very good. The particle size distribution will be narrow and even, and the cutting ability of silicon wafers will be improved.
Winner2000ZD is a humanized automatic laser particle size analyzer, which is another breakthrough in our company's particle size analysis technology. This instrument uses the Mie's scattering principle, convergent optical Fourier transform light path patent technology and unconstrained free-fitting data processing technology. At the same time, it also gives a series of modern signs such as automation and intelligence, making the operation easier and more convenient. Uniform and more stable results are the preferred partners and effective assistants for granular testing.
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